University of Copenhagen / Danish Government · Denmark
University of Copenhagen Danish Government Scholarship
Competitive Danish Government tuition waivers and grants for highly talented non-EU/EEA Master's students.
Opening Soon 159 days remaining
DestinationDenmark
Degree levelMaster's
FundingFully Funded, Tuition Waiver
Deadline15 January 2027
Eligibility at a glance
Pakistan eligibility Yes
Nationality Non-EU/EEA/Swiss applicants required to pay tuition fees
Minimum qualification Bachelor's/equivalent meeting the selected UCPH Master's admission criteria
Minimum grade Competitive academic merit; no universal minimum stated
Prerequisite background Academic background required by the selected Master's programme
Eligible fields of study Eligible UCPH Master's programmes across faculties; scholarship availability and benefits vary by faculty
Work experience Not generally required unless programme-specific
Age limit No general age limit stated
English / language Programme-specific UCPH language requirements
Admission required first Yes
Nomination required No
Application fee Host/national application fee may apply
What the scholarship covers
Tuition Full or partial tuition fee waiver
Stipend Some awards include a grant toward basic living expenses
Travel support Not standard
Insurance Not standard
Other benefits Automatic consideration after admission for eligible applicants
U Hashmi application guide
This database record is ready for a detailed U Hashmi editorial guide. Add your scholarship-specific strategy, application steps, common mistakes, examples and supporting blog links in the WordPress editor.
Verification & official source
Last verified: 8 August 2026
Deadline confidence: Confirmed
Non-EU Master's applicants are considered automatically. Standard September-entry non-EU deadline is 15 January.
Open Official Information Source
Scholarship requirements, funding, deadlines and eligibility can change. Always confirm the final application conditions on the official scholarship or university website before submitting.